Suzhou Delphi Laser Co., Ltd. engages in the research and development, manufacture, and sale of precision laser processing equipment and lasers in China and internationally. Its products include fully automatic glass laser chamfering systems, laser-induced dicing systems for silicon carbide and glass wafers, automatic polarizer laser cutting machines, UV picosecond laser micromachining systems, glass laser cutting and breaking systems, covering film/vehicle FPC processing application systems, laser-induced wafer dicing systems, wireless charging field cutting application systems, UV nanosecond laser cutting systems, femtosecond laser fine micromachining systems, laser fine processing systems, laser systems for wafer grooving, fiber laser ceramic processing systems, CO2 laser ceramic processing systems, AMOLED cell cutting systems, and roll-to-roll laser etching system for thin films. The company also offers reel-to-reel FPC drilling application systems, laser drilling systems for tempered glass, ultra-short pulse LTCC/HTCC drilling and etching systems, thin film laser etching systems, and laser repair systems for OLED/LCD, as well as processing materials; and laser equipment rental services. Its products are used in semiconductor, display, precision electronics, scientific research, and new energy applications. The company was founded in 2005 and is based in Suzhou, China.