BE Semiconductor Industries NV (BESI)

56.06
+2.32(+4.32%)
  • Volume:
    770,484
  • Bid/Ask:
    0.00/0.00
  • Day's Range:
    54.14 - 56.86

BESI Overview

Prev. Close
53.74
Day's Range
54.14-56.86
Revenue
808.51M
Open
54.2
52 wk Range
47.75-89.2
EPS
3.66
Volume
770,484
Market Cap
4.5B
Dividend (Yield)
3.33
(5.94%)
Average Volume (3m)
748,341
P/E Ratio
14.67
Beta
1.47
1-Year Change
-16.5%
Shares Outstanding
80,548,519
Next Earnings Date
20 Jul 2022
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BE Semiconductor Industries NV News

  • BE Semiconductor Earnings, Revenue beat in Q1
    • ByInvesting.com-

    Investing.com - BE Semiconductor reported on Friday first quarter earnings that beat analysts' forecasts and revenue that topped expectations. BE Semiconductor announced earnings...

  • BE Semiconductor sees higher revenues in Q2
    • ByFXEmpire-

    (Reuters) – Chipmaking equipment supplier BE Semiconductor (BESI) on Friday forecast a rise in its second-quarter revenues, citing feedback from its customers and suppliers.

BE Semiconductor Industries NV Company Profile

BE Semiconductor Industries NV Company Profile

BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.

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