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BE Semiconductor Industries NV (BSI1)

Frankfurt
Currency in EUR
Disclaimer
143.750
-3.300(-2.24%)
Closed
Fair Value
Unlock Value
Day's Range
143.750143.750
52 wk Range
74.160180.150
Bid/Ask
140.50 / 143.35
Prev. Close
147.05
Open
143.75
Day's Range
143.75-143.75
52 wk Range
74.16-180.15
Volume
0
Average Volume (3m)
114
1-Year Change
96.59%
Shares Outstanding
77,015,794
Fair Value
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Dividends Payment Streak
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Analysts
Technical
Strong Sell
Sell
Neutral
Buy
Strong Buy
Strong Sell
154.100
Upside +8.598%

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BE Semiconductor Industries NV Company Profile

BE Semiconductor Industries N.V. engages in the development, manufacture, marketing, sale, and service of semiconductor assembly equipment for the semiconductor and electronics industries in China, the United States, Malaysia, Ireland, Korea, Taiwan, Thailand, Other Asia Pacific and Europe, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company’s principal products include die attach equipment, such as single chip, multi-chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra-thin, and wafer level molding, as well as trim and form, and singulation systems. It also provides plating equipment, such as tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company’s principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

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