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Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company’s products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA, micro-SD cards, and SD cards. The company was founded in 1998 and is headquartered in Kaohsiung, Taiwan.
Name | Age | Since | Title |
---|---|---|---|
Chung Won Shu | - | - | Chairman of the Board of Directors |
Shu Chong Zheng | - | - | Executive Director |
Ci Fei Xiao | - | 2007 | Supervisor |
Shao Ai Ru | - | 2007 | Independent Supervisor |
Chen Yi Wen | - | - | Independent Director |
Long-De Guo | - | 2016 | Director |
Zhang Jia Xiang | - | - | Independent Director |
He Jun Bin | - | 2007 | Supervisor |
S. C. Teng | - | - | Director |
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