Inari Amertron Bhd (INAR)

Inari Amertron Berhad, an investment holding company, provides outsourced semiconductor assembly and test services for radio frequency, fiber-optics transceivers, optoelectronics, sensors, and custom IC technologies in Malaysia, Singapore, the United States, China, and internationally. The company offers wafer processing services covering probing, laser marking, die sawing, back grinding, flip-chip dice tape and reel, and automated visual inspection; and chip fabrication and wafer certification in fiber optic chips, such as wafer scribe and cleave, bar aligning, demount-load fixtures and facet coating, and chip on carrier. It also provides advanced system in package assembly and test services, including fine-pitch surface mount technology, high speed and high accuracy flip-chip dice placement, in-line post vision, molding underfill, and post-mold oxide plating and final testing; and other services, such as sensor and IC package design and characterization, process customization and assembly, product testing, box build, and direct customer drop-ship. In addition, the company manufactures semiconductor related products, communication chips, and die preparations, as well as offers electronic manufacturing services; manufactures, assembles, and tests optoelectronic and sensor components, modules, and systems; designs, develops, and manufactures fiber optic products; and invests in properties. Inari Amertron Berhad is based in Petaling Jaya, Malaysia.